./oschina_soft/gitee-WLP.zip
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WLP200 - WAFER LEVEL PACKAGE EVALUATION RC FILTER NETWORK - California Micro Devices Corp
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Abstract: Using a wafer-level package (WLP) can reduce the overall size and cost of your
2013-04-23 10:16
，封装无需向芯片外扩展，使得WLP的封装尺寸几乎等于芯片尺寸。） 2.高传输速度（与传统金属引线产品相比，WLP一般有较短的连接线路，在高效能要求如高频下，会有较好的表现。） 3.高密度连接（WLP
2023-04-06 17:50
(UART) in a tiny 2.1mm 2.1mm wafer level package (WLP). It provides many high-end features in hardware, thus reducing firmware complexity. Inst
2012-04-09 11:53
μPMICs for Multimedia Application Processors in a 3.0mm x 2.5mm WLP The MAX8893A/MAX8893B/MAX8893C
2010-05-29 10:16
package (WLP), is packedwith many advanced features in hardware, from individual 128 word transmit and receive FIFOs to extensive hardware-m
2012-03-31 10:16
andsmall footprint make it ideal for portable applications. The device features a highly flexible input scheme withsix input pins (WLP) that c
2013-02-20 10:33
