•One and two-dimensional process simulation program•Simulation etching, deposition, lithography, implantation,diffusion, epitaxy•Output
2009-10-17 16:56
微控制器的封装在系统的小型化中起着关键作用。对外围设备的选择上的权衡，垫计数和芯片尺寸都限制了能力，以减少微控制器的大小，但仍有助于减少终端设备的整体尺寸。
2017-05-31 11:39
对于可穿戴设备，小尺寸是组件选择的一个重要因素，包括那些用于电源。直流/直流转换器的出现，都可以提供高转换效率，同时最大限度地减少电路板空间整合转换控制器及关键无源器件到系统封装模块，有助于减少尺寸和简化的布局。
2017-06-01 15:22
FPGA原理1图手册Spartan-3ESpartan-3ESpartan-3ESpartan-3E
2015-12-03 16:15
Impedance Matching Techniques for VLSI PackagingWhy is packaging limiting performance??Inductive
2008-09-10 14:17
SPECIFICATIONTape and reel packaging for automatic component placement. Please enter required Suffix on order. Bulk packaging is no
2008-07-17 09:35
wafer level packaging processes; the packaged carrier waferis diced into components at the end. Full Wafer Level Packaging -----Bon
2011-11-23 14:39
MSOP-10Packaging Information 1. Package Dimensions3.00+0.104.90+0.203.00+0.100.15+0.080.53+0.130~6O
2008-07-02 14:27
). Because the QFN platform represents the latest in surface mount packaging technology, it is important that the design of the Printed
2009-04-27 15:53
Impedance Matching Techniques for VLSI Packaging Problem Statement•Reflections from
2008-09-10 14:16
