Impedance Matching Techniques for VLSI PackagingWhy is packaging limiting performance??Inductive
2008-09-10 14:17
MEMS，是否可以在LSM9DS1传感器上进行包覆成型？如果是，您是否建议任何具体的材料和工艺？ ＃lsm9ds1 #overmolding #packaging以上来自于谷歌翻译以下为原文 Hi
2019-03-22 10:22
Published in Global SMT & Packaging, November 2003
2019-08-09 14:20
成本以及拥有/减小成本。如何解决这些问题呢？层叠封装(PoP)的概念逐渐被业界广泛接受。PoP（Packaging on Packaging）,即堆叠组装，又称为叠层封装。POP采用两个或两个以上的BGA...
2021-12-27 07:43
求书《Fundamentals of Device and Systems Packaging: Technologies and Applications》
2021-06-22 06:46
oscillators, including resonator design, oscillatorperformances, temperature compensation, packaging
2009-12-12 17:43
一次修改吗？感谢 以上来自于百度翻译 以下为原文 Hello, Someone know how to know PIC revision with packaging marking
2018-09-10 15:37
technologies for dicing, packaging and assembly – a breakthrough that willrevolutionize the cost and range of application of MEMS. [hide][/hide]
2009-12-22 16:34
封装（Packaging）：IC封裝依使用材料可分為陶瓷（ceramic）及塑膠（plastic）兩種，而目前商業應用上則以塑膠構裝為主。以塑膠構裝中打線接合為例，其步驟依序為晶片切割（die
2018-08-23 19:07
there,Does anyone have any information regarding silent installation of GRID drivers?Or packaging
2018-09-04 15:19
