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  • Substrate创新者的区块链开发平台

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  • CA3018, CA3018A pdf datasheet

    monolithic substrate.Two of the four transistors are connected in the Darlingtonconfiguration. The substrate is connected to a sepa

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  • APTD1608CGCK datasheet

    APTD1608CGCK datasheet The Green source color devices are made with AlGaInP onGaAs substrate Light Emitting Diode.

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  • MOS功率场效应晶体管ixkn75n60c

    to the heatsink for reduced EMI - High power dissipation due to AlN ceramic substrate

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  • ixtf1n450高压功率MOSFET

    Features  Silicon Chip on Direct-Copper Bond (DCB) Substrate  Isolated Mounting Surface  4500V

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  • CADENCE SIP RF ARCHITECT

    and analogcontent on the same substrate, it presents a number of challenges. These includedesigning and integrating RF/analog chips wi

    2008-10-16 09:51

  • 先进倒装芯片封装

     详细介绍了FC技术,bumping技术,underfill技术和substrate技术,以及倒装封装芯片的热设计,机械应力等可靠性设计。

    2023-11-01 15:25

  • CADENCE SIP RF LAYOUT

    and analogcontent on the same substrate, it presents a number of challenges. These includedesigning and integrating RF/analog chips with

    2008-10-16 09:48

  • High Frequency Continuous Time

    that analog circuits will have tocoexist on the same substrate along with massive digital systems.Since technologies are optimized

    2009-07-21 09:26

  • 嵌入式系统的自测试算术

    indicate that the ever-increasing degree of integration of devices on a single substrate continuously demands more efforts in a

    2009-07-25 15:06