A circuits become faster, more concern needs to be focused onpackaging and interconnects in order to fully utilize deviceperformance. One area of concern is with the package leadsbetween the chip and the board environment. The
2009-03-30 00:12
Features International Standard Packages Fast Intrinsic Rectifier Avalanche Rated Low RDS（ON） and QG Low Package Inductance Advantages
2017-09-21 09:21
ELECTRICAL SPECIFICATIONS:1. Primary Inductance (Lp) = 4.1mH (±2% @10KHz)2. Primary Leakage
2009-10-17 10:05
inductance reduction• Grounding of cable shields• Grounding loops
2010-06-01 08:16
some circuit operation a little hard to understand. Straycapacitance and stray inductance afflict these circuits. Stray capacitanc
2009-07-27 16:49
be built with short interconnectleads. When wiring components, care should be taken to providea low resistance, low inductance path to
2009-08-29 15:50
used to eliminate voltage spikescaused by circuit inductance when a switch — either mechanical or semi-conductor—
2009-11-27 11:28
inductance and yggpcapacitance that results in microstriplines with higher impedance, band rejections, and slow-wave characte
2010-08-17 10:42
metal-oxide semiconductor field-effecttransistor. The nonlinearity of the capacitors of the devices andthe parasitic inductance i
2009-11-26 11:16
some circuit operation a little hard to understand. Straycapacitance and stray inductance afflict these circuits. Stray capacitanc
2009-07-27 16:48
