你好，我试图在sp601上使用外部RAM（Elpida DDR2内存），因为我没有资源在fpga中创建任何内存。我有几个问题。1）如果我是对的，我必须通过fpga上的MCB块连接外部存储器。我在
2019-06-13 06:57
新的elpida的型号DDR3-1600的，我现在仍然想降频让新的DDR运行在原来的1333主频下，我在DM816x_C6A816x_AM389x_EMIF4_Register_Settings.xls中如下
2018-05-28 09:47
您好，我一直在按照本教程将Ubuntu放在Pandaboard Rev A4上：为PandaBoard我遵循了教程，但是当我将SD卡插入pandaboard并通过5V电源插孔给它供电时，HDMI中没有任何内容。这是我的设置问题还是我错过了一步？为了进行初始启动，它是通过hdmi还是通过串行终端完成的？以上来自于谷歌翻译以下为原文Hello, I have been following this tutorial to put Ubuntu on a Pandaboard Rev A4:PandaBoardI followed the tutorial however when I plug the sd card into the pandaboard and give it power through the 5V power jack nothing appears through the HDMI.Is this a problem with my setup or am I missing a step? In order to do the initial boot up is it done through the hdmi or through a serial terminal?
2018-10-22 14:21
你好，有没有人使用过Digilent的Atlys主板？热衷于了解获得的DDR b / w以及适合使用该内存的MIG设置。目前还没有参考设计干杯，马尼什
2019-10-16 01:28
嗨，我有一个Spartan-6 / DDR2系统，两者都在大约60-70°C的温度下运行。设计（存储器）运行在300 MHz。休息几乎是MIG使用的默认值。 Microblaze以100 MHz运行。对于我的应用，温度可能很高。我能做些什么才能进入~40°C区域？降低内存频率并没有太大帮助。会改用LPDDR（真的）吗？有没有人有使用Xilinx SP601（DDR2）和Avnet LX9 MicroBoard（LPDDR）的经验？我的系统可能会降低内存性能。就像在重新设计上付出太多努力之前要检查一样。使用mhs文件，我发现600MHz的两个时钟（一个0度和一个180度）。需要两个因素是什么？我发现axi_s6_ddrx需要2x作为输入 - 但这可能是一个优化（在FPGA方面）？ DDR应该涵盖哪个阶段？谢谢 - 短剑以上来自于谷歌翻译以下为原文Hi, I got a Spartan-6 / DDR2 system, both running at about 60-70 °C. The design (memory) runs at 300 MHz. Rest is pretty much defaults used by MIG. Microblaze runs at 100 MHz. The temperature may be to high for my application. Is there anything I can do to get it into the ~40°C region? Reducing the memory frequency did not help too much. Would using LPDDR instead (really) help? Does anyone have experience with the Xilinx SP601 (DDR2) vs. the Avnet LX9 MicroBoard (LPDDR) ? My system could bear some degradation in memory performance. Just like to check before putting too much efforts in redesigning. With the mhs file I found two clocks at 600MHz (one 0 deg and one 180 deg). What is the factor of two needed for? I found axi_s6_ddrx needs the 2x as an input - but could this be an optimisation (on the FPGA side) ? DDR should be covered by the phase? Thanks--Dirk
2019-06-25 08:20
晶圆级封装技术源自于倒装芯片。晶圆级封装的开发主要是由集成器件制造厂家（IBM）率先启动。1964年，美国IBM公司在其M360计算器中最先采用了FCOB焊料凸点倒装芯片器件。
2020-03-06 09:02
嗨， 我想知道哪个DDR3内存部件可以与Spartan-6配合使用。 SP601上的DDR2部件是aEDE1116AEBG，但在Digikey，Avnet或Farnell上不可用。无论如何我会用DDR3获得更好的性能，DDR3的可用性可能不如DDR2，但我不想在部件选择中出错并选择一个已知的部件，并得到MIG发电机的支持在ISE。最好的祝福，埃尔维斯·道森以上来自于谷歌翻译以下为原文Hi, I would like to know which DDR3 memory part is known to work with the Spartan-6. The DDR2 part on the SP601 is a EDE1116AEBG, but it is not available on Digikey, Avnet or Farnell. I would get better performance with DDR3 anyway, and availability might be less of a problem for DDR3 than DDR2, but I would like to not make mistakes in part selection and choose a part that is known right away, and has support by the MIG generator in ISE. Best regards, Elvis Dowson
2019-05-21 06:16
