半导体器件物理与工艺的主要内容：第一章 能带与载流子浓度第二章 载流子输运现象第三章 p-n结第四章 双极型器件第五章 单极型器件第六章 微波器件第七章
2009-07-22 12:11
primitives directly from the physics of the used materials andthe topography of the circuitry. The complexity of the performed computation
2009-07-21 08:53
Twentieth-century physics began with Planck’s postulate,in 1900, that electromagnetic radiation
2008-11-27 13:01
primitives directly from the physics of the used materials andthe topography of the circuitry. The complexity of the performed computation
2009-07-21 08:55
the applied voltage as it rises. Programmable logic attempts to emulate that behavior,but physics forbids perfect emulation, due to the device p
2012-02-16 15:33
primitives directly from the physics of the used materials andthe topography of the circuitry. The complexity of the performed computation
2009-07-21 08:59
with an antibiotic, a vaccine, or someform of cure-all. Unfortunately, solving the RS problem is not that easy. Indeed, the laws of physics apply
2012-01-04 11:35
of field emission physics1958 Buck and Shoulders (SRI)-Proposals for fabricatingvacuum microelectronic devices1961 Shoulde
2008-11-01 14:02
the natureof the design process in industry. Starting with architecture design, the book explains the why andhow of digital design, using the physics
2012-01-17 16:57
IGBT损耗计算和损耗模型研究：器件的损耗对系统设计尧器件参数及散热器的选择相当重要。损耗模型主要分为两大类院基于物理结构的IGBT损耗模型渊physics-based冤和基于数学方法的IG
2009-06-20 08:33
