DIE-R-HA-1
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都需要做功能级别测试的。chip probing基本原理是探针加信号激励给pad，然后测试功能。 a. 测试对象，wafer芯片，还未封装； b. 测试目的，筛选，然后决定是否封装。可以节省封装
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Wafer test system PM&CalibrationJeffrey.Bin 第1 页共16 页Wafer test system PM&CalibrationRev
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NEUTRIK - DIE-R-BNC-X - Crimp Tool Die, Hex 1.75mm Crimp Pin Contacts, Neutrik HX-R-BNC Crimp Tool Frame
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NEUTRIK - DIE-R-BNC-PY - Crimp Tool Die, 1.6mm Crimp Pin Contacts, Neutrik HX-R-BNC Crimp Tool Frame
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NEUTRIK - DIE-R-BNC-ZPLUS - Crimp Tool Die, 1.8mm Crimp Pin Contacts, Neutrik HX-R-BNC Crimp Tool Frame
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WAFER-125L-7P
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WAFER-254W-4P
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WAFER-100L-6P
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WAFER-254W-3P
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