LEAD I ECG 测量系统。通过一种使用 OPA2333 的仪器前端，超低功耗得到了优化并由 18 位 ADS8881 进行数字化。了解 TI 高精度设计的更多信息主要特色18 位，10ksps
2018-11-15 11:44
This document provides details on QFN component test methodology and best practices to ensure robust testing and quality results. The QFN algorithm was introduced in 5DX software version 8.4, and enhanced and simplified in patch version 8.4.1.
2019-10-16 10:46
Performance (iVTEP) can be used for ultra-small geometry packages, flip chips, as well as devices with minimal or no lead frames and heat spreaders.
2018-09-25 17:22
Process defects that escape in-circuit test lead at best to increased repair costs, and at worst to a "bone pile1" problem.
2019-05-22 16:12
options, such as X-ray laminography, capacitive lead-frame testing, parasitic diode analysis, inductive
2019-04-10 13:37
of eutectic tin-lead solder and towards utilization of lead-free compounds.
2019-03-04 12:15
, repair issues, and the merits of different alloys.This paper addresses the impacts on test and inspection when going lead-free.
2019-09-11 09:53
to lead-free manufacturing. It also addresses different test and inspection systems’ readiness to test lead-free printed circuit bo
2019-09-11 08:04
for testing Advanced Mobile Phone System (AMPS) Cellular Base Station equipment. It will lead you...
2019-02-19 11:43
Quad Flat No-Lead (QFN) packages are increasingly used on printed circuit boards. The QFN solder
2019-10-25 17:16
