芯片封装设计中的wire_bonding知识介绍Wire Bond/金线键合： 指在对芯片和基板间的胶粘剂处理以使其有更好的粘结性能后,用高纯金线把芯片的接口和基板的接口键合 成分为金（纯度为
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WITHZYTELRM - 5.00mm (.197") Pitch Appli-Mate RAST 5 Header, Vertical, 2 Circuits, Reference K03, Tin (Sn) Plating, Glow Wire Compatible - Molex Electronics Ltd.
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NUT BONDING GROUND KIT
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