selection and circuit design techniques? PART 3: Printed circuit board layout techniques? APPENDIX A
2009-10-15 14:20
H15Z15 Board circuit !!!!!!!
2015-07-04 11:57
, printed-circuit-board (PCB) layout is often one of the last steps in the design process.
2015-01-23 11:01
Diode Circuit??Preview??Rectifier circuits??Zener diode circuits??Clipper and clamper circuits??Multiple-diode circuits??Photodiode and LED circuits
2009-08-20 19:13
Design of Combinational CircuitWhat is Combinational CircuitCombinational Circuit if–Outputs at a
2008-09-11 09:33
那位高手有circuit cam软件？
2013-09-23 17:36
AsynchronousvsSynchronous Circuit DesignMainly useCombinationalLogic to do the decoding–Address
2008-09-11 09:18
LAN91C1111 lan circuit applicationLAN9115 lan circuit application
2009-12-04 16:34
本帖最后由 jf_55150483 于 2023-12-21 18:21 编辑 CIRCUIT060074 data sheet
2023-12-21 13:38
1.PCB(Printing CircuitBoard）材料：印刷线路板，是由覆铜层压板制成，常用的覆铜层压板是覆铜酚醛纸质层压板、覆铜环氧纸质层压板，覆铜环氧玻璃层压板、覆铜环氧酚醛玻璃布层压板，覆铜聚四氟乙烯玻璃布层压板和多层板用环氧玻璃布等。环氧树脂与铜箔有很好的粘合力，且用环氧树脂做成的板子可以在260℃的锡炉中不起泡，也不容易受潮，故此种材料制作成的PCB应用较多。超高频的PCB最好使用覆铜聚四氟乙烯玻璃布层压板。在要求阻燃的PCB中也加入了一些阻燃树脂材料。2.PCB(Printing CircuitBoard）板层：（以四层板为例）silk screen (Top overlay): 丝印层solder Mask (Top/Bottom): 阻焊层Paste Mask (Top/Bottom): 锡膏层Top:顶层是元件层Bottom:底层是焊接层Drill Guide(Drill Drawing):钻孔层Keep out layer:禁止布线层，用于设置PCB边缘Mechanical Layer:机械层用于放置电路板尺寸Multi Layer: 穿透层Vcc Layer:中间电源层Gnd Layer: 中间地层
2015-12-09 12:06
