This document provides guidelines for Printed Circuit Board (PCB) design and assembly. Package performance such as: MSL rating, board level reliability, electrical parasitic and thermal resistance data are included as reference.
2010-01-12 18:44
This document provides details on QFN component test methodology and best practices to ensure
2019-10-16 10:46
什么是QFN封装？QFN（Quad Flat No-lead Package，方形扁平无引脚封装）是一种焊盘尺寸小、体积
2024-01-13 09:43
QFN封装的特点 QFN（Quad Flat No-lead Package，方形扁平无引脚封装）是一种焊盘尺寸小
2009-11-19 09:15
Various ON Semiconductor components are packaged in an advanced Dual or Quad Flat−Pack
2009-04-27 16:27
QFN（Quad Flat No-lead Package，方形扁平无引脚封装）是一种焊盘尺寸小、体积小、以塑料作为密封材料的新兴的表面贴装芯片封装技术。由于底部中央大
2018-08-23 15:11
QFN（Quad Flat No-lead Package，方形扁平无引脚封装）是一种焊盘尺寸小、体积小、以塑料作为密封材料的新兴的表面贴装芯片封装技术。由于底部中央大
2019-05-31 10:07
Quad Flat No-Lead (QFN) packages are increasingly used on printed circuit boards. Th
2019-10-25 17:16
QFN封装的PCB焊盘和印刷网板的设计 近几年来，由于QFN封装（Quad Flat No-lead package，
2009-04-15 00:43
四面无引线扁平封装(Quad Flat No-lead Package, QFN)属于表面贴装型封装， 是一种无引脚且呈方形的封装， 其封装四侧有对外电气连接的导电焊盘
2023-08-21 17:31
